ANSI/IPC J-STD-005A

ANSI/IPC J-STD-005A

Requirements for Soldering Pastes Association Connecting Electronics Industries / 01-Feb-2012 / 24 pages

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This standard lists requirements for qualification and characterization of solder paste. It references test methods and criteria for metal content, viscosity, slump, solder ball, tack and wetting of solder pastes.



This product replaces:ANSI/IPC J-STD-005 - Requirements for Soldering Pastes, Includes Amendment 1 (2007)
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ANSI/IPC J-STD-005A
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