BS EN 61249-2-21:2003

Cross References:
IEC 60194:1999
IEC 61249-1
IEC 61249-6-3
IEC 61189-2:1997
IEC 61249-5-1:1995
ISO 9000:2000
ISO 11014-1:1994
ISO 14001:1996
EN 61189-2:1997
EN 61249-5-1:1996
EN ISO 9000:2000
EN ISO 14001:1996




Keywords: Printed-circuit boards; Printed circuits; Printed-circuit bases; Coated materials; Reinforced materials; Specification (approval); Electronic equipment and components

Product Code(s): 30057299,30057299

This product references:BS EN 61189-2:1997 - Test methods for electrical materials, printed boards and other interconnection structures and assemblies. Test methods for materials for interconnection structures
BS EN 61249-5-1:1996 - Materials for interconnection structures. Sectional specification set for conductive foils and films with and without coatings. Copper foils (for the manufacture of copper-clad base materials)
BS EN ISO 9000:2000 - Quality management systems. Fundamentals and vocabulary
BS EN ISO 14001:1996 - Environmental management systems. Specification with guidance for use
ISO 11014-1:1994 - Safety data sheet for chemical products -- Part 1: Content and order of sections
ISO 14001:1996 - Environmental management systems - Specification with guidance for use
This product referenced by:BS EN 60893-3-2:2004 A1:2011 - Materials for printed boards and other interconnecting structures. Reinforced base materials, clad and unclad. Non-halogenated epoxide woven E-glass reinforced laminated sheets of defined flammability (vertical burning test), copper-clad