BS EN 61249-2-38:2009

Cross References:
IEC 61189-2:2006
IEC 61249-5-1:1995
ISO 9000
ISO 11014-1
ISO 14001
EN 61189-2:2006
EN 61249-5-1:1996
EN ISO 9000:2005
EN ISO 14001:2004
IEC 61249-6-3
IEC 60194:2006
EN 60194:2006


All current amendments available at time of purchase are included with the purchase of this document.



Keywords: Printed-circuit boards; Printed circuits; Printed-circuit bases; Reinforced materials; Epoxides; Glass fibres; Sheet materials; Laminates; Flammability; Copper; Foil; Coated materials

Product Code(s): 30164998,30164998

This product references:BS EN 61189-2:2006 - Test methods for electrical materials, printed boards and other interconnection structures and assemblies. Test methods for materials for interconnection structures
BS EN 61249-5-1:1996 - Materials for interconnection structures. Sectional specification set for conductive foils and films with and without coatings. Copper foils (for the manufacture of copper-clad base materials)
BS EN ISO 9000:2005 - Quality management systems. Fundamentals and vocabulary
ISO 9000 - Quality management systems - Fundamentals and vocabulary
BS EN ISO 14001:2004 - Environmental management systems. Requirements with guidance for use
This product referenced by:BS EN 61249-4-17:2009 - Materials for printed boards and other interconnecting structures. Reinforced base materials, clad and unclad. Non-halogenated epoxide woven E-glass laminate sheets of defined flammability (vertical burning test), copper-clad for lead-free assembly