TIA/EIA J-STD-607
TIA/EIA J-STD-607
Commercial Building Grounding and Bonding Requirements for Telecommunications Telecommunications Industry Assn/Electronic Industries Alliance / 01-Oct-2002 / 54 pages
Commercial Building Grounding and Bonding Requirements for Telecommunications Telecommunications Industry Assn/Electronic Industries Alliance / 01-Oct-2002 / 54 pages
Commercial Building Grounding and Bonding Requirements for Telecommunications, also known as TIA/EIA-607, can be utilized with or without prior knowledge of the telecommunications systems installed in the building. This Standard supports a multivendor, multiproduct environment, as well as the grounding practices for various systems that may be installed on customer premises. TIA/EIA-607 will be useful to manufacturers of telecommunications equipment, purchasers, installers, or operators of equipment and devices for specifying the exact interface points between the building grounding systems and the telecommunications equipment grounding configuration, and for specifying building grounding configurations needed to support this equipment. TIA/EIA-607 will also help building owners and developers who want to build an advanced technology structure that is compatible with modern telecommunications equipment.
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