BS CECC 200025:1998

Cross References:
EN 100114-1
CECC 00114-5
CECC 00200
CECC 00401
EN ISO 9000
EN ISO 9002
IEC 61189
IEC 61191-1
IEC 61191-2
IEC 61191-3
IEC 61191-4
IEC 61760-1
CECC 200003
CECC 200012
ISO 1000
IEC 60027
IEC 60050
IEC 60617




Keywords: Electrical components; Electronic equipment and components; Quality assurance systems; Assessed quality; Qualification approval; Approval testing; Inspection; Specification (approval); Printed-circuit boards ; Printed circuits; Assembling; Production equipment; Process control; Identification methods; Defects; Error correction; Consumer-supplier relations; Instructions for use; Handbooks; Detail specification; Marking; Ordering; Reports; Layout; Verification; Safety measures

Product Code(s): 01451318,01451318

This product references:IEC 61191-1 Ed. 1.0 b:1998 - Printed board assemblies - Part 1: Generic specification - Requirements for soldered electrical and electronic assemblies using surface mount and related assembly technologies
IEC 61191-4 Ed. 1.0 b:1998 - Printed board assemblies - Part 4: Sectional specification - Requirements for terminal soldered assemblies
ISO 1000:1992 - SI units and recommendations for the use of their multiples and of certain other units
IEC 61191-2 Ed. 1.0 b:1998 - Printed board assemblies - Part 2: Sectional specification - Requirements for surface mount soldered assemblies
IEC 61760-1 Ed. 1.0 b:1998 - Surface mounting technology - Part 1: Standard method for the specification of surface mounting components (SMDs)
IEC 61191-3 Ed. 1.0 b:1998 - Printed board assemblies - Part 3: Sectional specification - Requirements for through-hole mount soldered assemblies